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„The A1 wonder foam“ The A1 wonder foam Substrate: Wood, metals, mineral substrates Max. temperature: 1,100° C viscosity: liquid to paste-like. Adjustable calorific value: Cooling in the event of fire FireFoe (m) is a two-component,...
HTS 300 High-Temperature Silicone
‘Elastic and temperature-resistant’ HTS 300 is a temperature-resistant, elastic sealant and adhesive. It is useful in heat-exposed joins and seals that are subject to dynamic loads or drastic temperature deviations. As a result, the...
HTK 19580 High-Temperature Adhesive
‘Adhesion in extreme temperatures’ HTK 19580 is based on an inorganic, solvent-free compound formula that is particularly well suited to the adhesion of metals, ceramic, fireclay, glass etc. Areas of applications include heat-exposed...
DK 27 Sealing Putty
‘Adhesion/sealing on vertical surfaces’ DK 27 is an inorganic adhesive and sealant that withstands application temperatures of up to 1,300°C. The highly viscose paste can be applied to vertical surfaces and ceilings. Its high temperature...
DK 49 Sealing Putty
‘Combustion seal up to 300°C’ DK 49 is especially well suited to sealing cast iron boilers to prevent flue gas leakage. The product can be used anywhere requiring long-lasting temperature resistance as well as the crack-free filling of...
HTP 18499 High-Temperature Sealing Paste
‘Residual elasticity up to 600°C’ HTP 18499 is a paste-like, solvent-free product that is used as a sealant and adhesive in various technical areas in ongoing temperatures up to 600°C. Once cured, this product provides a ductile...
HTP 23998 High-Temperature Sealing Paste
‘Seals in high-temperature areas’ HTP 23998 is a solvent-free high-temperature sealant paste that is especially used as a sealant and adhesive in areas with ongoing temperatures up to 1,100°C. The product is suitable for the...
NTKM 14822 Low-Temperature Mouldable Adhesive...
‘Securing cast components’ NTKM 14822 is a plastic mouldable putty with temperature stability up to approx. 300°C that can be used to temporarily secure casting technology components.